JPH0410339U - - Google Patents
Info
- Publication number
- JPH0410339U JPH0410339U JP5074790U JP5074790U JPH0410339U JP H0410339 U JPH0410339 U JP H0410339U JP 5074790 U JP5074790 U JP 5074790U JP 5074790 U JP5074790 U JP 5074790U JP H0410339 U JPH0410339 U JP H0410339U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor package
- die pad
- shape
- dispersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5074790U JPH0410339U (en]) | 1990-05-17 | 1990-05-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5074790U JPH0410339U (en]) | 1990-05-17 | 1990-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410339U true JPH0410339U (en]) | 1992-01-29 |
Family
ID=31569565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5074790U Pending JPH0410339U (en]) | 1990-05-17 | 1990-05-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410339U (en]) |
-
1990
- 1990-05-17 JP JP5074790U patent/JPH0410339U/ja active Pending